SI200

Description

The SI200 is an innovative semi-industrial key-cutting machine targeting businesses with medium production volumes.

Based on a top-of-the-line PC-based motion platform from Yaskawa/Omron, combined with powerful, user-friendly job management software, the SI200 features standard machining stations for bitting and profiling processes.

Thanks to its computerized capabilities and its automatic key blank feeder and unloading stations, the SI200 requires minimal manpower to operate. It is suitable for cutting a broad variety of key types and offers cut-to-code and key marking capabilities. Additional options include laser marking and brushing stations.

Specifications
Width: 1200 mm (47.2")
Height: 1900 mm (74.8")
Depth: 800 mm (31.5")
Motor: Single phase 300W
Voltage: 110v 60 Hz, 220v 50 Hz
Weight: 50kg (1005 lbs)
Approval: CE Machinery Directive (89/392/EEC)